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Side Entry Modular SMT Jack 4P

"Enhance Efficiency and Performance with Side Entry Modular SMT Jack 4P!"

  • $500
    ≥1000
    Piece/Pieces
Payment Type:
L/C,T/T,Paypal
Incoterm:
FOB,CFR,CIF,EXW
Min. Order:
1000 Piece/Pieces
Transportation:
Ocean,Air,Express
Port:
Shenzhen
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  • Product Description
Overview
Product Attributes

Model No.ATRJ5822-4P4C-X-A-X

BrandAntenk

Place Of OriginChina

Interface TypeD-SUB(VGA)

HousingPlastic

PinBrass

PolesOther

ApplicationOther

CertificationCE

GenderMale

MaterialCopper

Support Card NumberOther

Operating FrequencyHigh Frequency

ClassificationWired Broadband Connection

Inner PackingTray

Supply Ability & Additional Information

Packagingbag packing,Tube packing, reel packing

Productivity2000K/Month

TransportationOcean,Air,Express

Place of OriginChina

Supply Ability2000K/Month

CertificateISO 9001-2015

HS Code8536909000

PortShenzhen

Payment TypeL/C,T/T,Paypal

IncotermFOB,CFR,CIF,EXW

Packaging & Delivery
Selling Units:
Piece/Pieces
Package Type:
bag packing,Tube packing, reel packing

Introducing our innovative Side Entry Modular SMT Jack 4P, designed specifically for professionals seeking high-performance connectivity solutions. This cutting-edge jack offers seamless integration into your existing systems, ensuring reliable and efficient data transmission. With its modular design, it provides flexibility for various applications, enabling easy customization and future-proofing. The robust construction guarantees durability and longevity, even in demanding environments. Featuring advanced SMT technology, this jack ensures precise and secure connections, minimizing signal loss and maximizing performance. Whether you're in telecommunications, electronics, or industrial automation, our Side Entry Modular SMT Jack 4P is the ultimate choice for professionals seeking top-notch connectivity solutions.

Side Entry Modular SMT Jack 4P


Specifications:

MATERIAL:

   1.HOUSING MATERIAL:GLASS FILLED POLYESTER UL94V-0.
   2.CONTACT MATERIAL :PHOSPHOR BRONZE t=0.35mm
   3.PLATING:SELECTING GOLD PLATING                                    
1u"~50u"OVER NICKEL IN CONTACT AREA.150u"TIN  PLATING
OVER NICKEL IN SOLDER AREA.
   4.SHIELD:0.25mm THICKNESS COPPER ALLY WITH NICKEL .PLATEL 
ELECTRICAL:
   1.VOLTAGE PATING :125 VAC RMS.
   2.CURRENT PATING :1.5 AMP
   3.CONTACT RESISTANCE:35  MILLIOHMS MAX 
   4.INSULATION   RESISTANCE:1000 MEGOHMS MIN @ 500V DC.
   5.DIELECTRIC WITHSTANDING RESISTANCE: 1000V AC RMS 60Hz.1MIN
MECHANICAL:
   1.DURRABILITY:750 CYCLES MIN
   2.PCB RETENTION PRE-SOLDER :10LB MIN
ENVIRONMENTAL:
   1.STORAGE :-40℃ TO +85℃ .
   2.OPERATION:-40℃ TO +85℃ .

   3.IR REFLOW SOLDERING TEMPERRATURE:255~265℃(5~10  SECONDS)MATES WITH MODULAR PLUG CONFORMING TO FCC PART 68 SUBPART F.


ATRJ5822-4P4C-X-A-X

Product Categories : Modular Jack RJ45 > 58 Modular Jack

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