2.00mm Pitch SMT Wafer PAD Sokcet

Introducing our latest innovation, the 2.00mm Pitch SMT Wafer PAD Socket! Designed with professionals in mind, this cutting-edge socket offers unparalleled connectivity and reliability. Engineered to accommodate wafer-sized components, it ensures precise and secure connections for seamless integration into your electronic devices. With its compact design and high-quality materials, this socket guarantees exceptional performance even in demanding environments. Whether you're a seasoned engineer or a tech enthusiast, our 2.00mm Pitch SMT Wafer PAD Socket is a must-have tool for your next project. Upgrade your connectivity solutions today and experience the difference firsthand!

2.00mm Pitch SMT Wafer PAD Sokcet

Specifications:
·Current Rating: 3A AC.DC
·Voltage Rating: 100V AC.DC
·Withstanding Voltage：800V AC/minute
·Insulation Resistance:1000MΩ Min
·Contact Resistance：10mΩMax
·After Environmental Testing:≤20mΩ 
·Temperature Range: -25°C-+85°C

Wafer
·Material：PA9T,UL94V-0
·Mates With:AH2015C-NP Housing
·Material(PIN and Solder Tabs):Brass TIN Plated

·Mates With:AH2013C-NP